CISTELAIER S.P.A.

PCB Leading Technology

Member for+ 7 years

Last update:

Contact - CISTELAIER S.P.A.

VIA GANDHI 1
41122 MODENA (MO)

Italy

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Latest products added

HDI - HIGH DENSITY INTERCONNECTIONS PCBS

HDI - HIGH DENSITY INTERCONNECTIONS PCBS

MIXED MATERIAL PCBS

MIXED MATERIAL PCBS

FLEX & RIGID-FLEX PCBS

FLEX & RIGID-FLEX PCBS

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Legal information - CISTELAIER S.P.A.

Nature Secondary establishment : Factory
Year established 2000
Legal form SOCIETA' PER AZIONI CON SOCIO UNICO
Describe your Company and attract Business opportunities (ATE07) Fabbricazione di altri componenti elettronici (261109)
Corporate capital 6,100,000 EUR
CF (Codice Fiscale) 02684440361
Registration No. MO 322110
VAT no IT02684440361
No employees 131 Employees
Kompass ID? IT0101442
Kompass member for + 7 years
Membership Booster International

Presentation - CISTELAIER S.P.A.

Cistelaier S.p.A. is a company belonging to FinMasi Group PCB Division, established in 1998 merging two industrial entities: Cistel S.r.l., established in Genoa in 1976 and Laier S.r.l., established in Modena in 1986.

In 2011, after the acquisition of  Techci - a well known French printed circuit board manufacturer - Cistelaier became part of the PCB Division of Finmasi Group, which today belong the Italian Cistelaier,  Techci and EPN Electroprint GmbH. All of them are European PCB manufacturers.

Cistelaier S.p.A. manufactures prototypes, small, medium and large series of a very wide range of printed circuit boards (up to 40 layers): double-sided, multilayer, rigid-flex, HDI (multilayer as well as flex-rigid) PCBs and boards realised with special materials.

Cistelaier mission is to become the main benchmark in Europe for companies seeking service, quality and know-how to make the PCB a strategic instrument for their business.

Download our brochure for all the details on our products / services.
 

Company catalogues -  CISTELAIER S.P.A.

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Company Capabilities (English)

24 pages

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General Information -  CISTELAIER S.P.A.

Banks

Contact people - CISTELAIER S.P.A. Download the executives list

MARCELLO MASI

Chairman (PRESIDENTE)

ROBERTO ARGINELLI

Director (MEMBRO DEL CONSIGLIO DI AMMINISTRAZIONE)

CLAUDIO GUERZONI

Director (MEMBRO DEL CONSIGLIO DI AMMINISTRAZIONE)

MARCELLO MASI

Director (MEMBRO DEL CONSIGLIO DI AMMINISTRAZIONE)

PAOLO MASI

Director (MEMBRO DEL CONSIGLIO DI AMMINISTRAZIONE)

GIACOMO VILLANO

Director (MEMBRO DEL CONSIGLIO DI AMMINISTRAZIONE)

PAOLO MASI

Vice-President (VICE PRESIDENTE)

GIACOMO VILLANO

Legal Representative (LEGALE RAPPRESENTANTE)

ALBERTO BARALDI

Auditor (AUDITOR)

PATRIZIA IOTTI

Auditor (AUDITOR)

GIANLUCA RICCARDI

Auditor (AUDITOR)

LUCA ROSSINI

Auditor (AUDITOR)

DANIELE SERRA

Auditor (AUDITOR)

News -  CISTELAIER S.P.A.

Nov 16 2020
Press release

SURFACE FINISHES FOR PCBs: LET’S GO INTO DETAIL!

Date: November 16, 2020 11:00 PM

End: November 17, 2050 10:59 PM

As explained in the previous article, for Printed Circuit Board (PCB) manufacturing surface finishes technologies have a crucial role in electronic components assembling.
 
Each surface finishing has specific characteristics, which mark pros and cons and, referring to cons, right tricks and precautions can be taken during PCB manufacturing.
 
Let’s go into detail of the most common surface finishes.
 
____________________________________________________________________________________________________________
 
HASL Lead Free-HASL Sn/Pb                                               Normative reference IPC-6012
 
PCB is immersed in a bath of molten tin and then hit by high-pressure hot air jets that flatten the thickness and remove the excess from holes and pads.
Thickness varies from 1 to 45 µm and is influenced by pad geometry, for this reason it is not particularly suggested for HDI PCB with VFP ( Very Fine Pitch) and BGA ( Ball Grid Array).
This finish is not suggested for flex and rigid-flex PCBs since thermic and mechanical stress coming from process air jets could damage the boards.
This type of finishing is particularly suggested for multiple soldering cycles and for long storages since tin alloy is characterized by longer Shelf Life.
__________________________________________________________________________

ENIG                                                                                        Normative reference IPC-4552
 
Chemical process which plates the exposed copper with Nickel and Gold.
Nickel thicknesses are usually 3-6 µm, while for Gold the minimum thickness is 0.05 µm as provided in the normative reference.
This chemical finish, differently from HASL, is particularly suggested for HDI PCB with VFP and BGA, since coating planarity and homogeneity are granted.
These characteristics make this finish suitable also for press-fit technology for which it is really important holes’ diameter tolerance respect.
 
Immersion TIN                                                                        Normative reference IPC-4554
 
Immersion Tin, more commonly named Chemical Tin, is a surface finishing, which has begun to be widely adopted from the beginning of year 2000, mainly sponsored in Automotive sector attracted to the chance to have an automatic horizontal process with tin planarity coating, differently from HASL.
 
This surface finishing results critical for the handling and is particularly sensitive to storage conditions; therefore, is strongly recommended to assemble PCB with this finishing within 3 months from manufacturing date to have an optimal operative window. Is not particularly indicated for multiple assembling given the thin copper thickness (0.8-1 µm) and given that at each soldering step the surface intermetallic layer increases, limiting the weldability.
For this kind of finishing is fundamental the vias treatment, is necessary to plug holes or to keep them completely open to avoid issue such as Acid Traps and consequent risk of delayed hole dismetallization.
IPC4761, guideline for vias treatment, suggests a Tenting double side or complete Pluggin  ( Image 2)  for this kind of finishing, to avoid that finishing residues could be trapped inside the holes ( Image 1) with the consequence to experience corrosion of hole walls through time.

Immersion Silver                                                                    Normative reference IPC-4553
 
Realized by a chemical process of immersion through which a Silver layer with variable thickness between 0,2 and 0,4 µm would be deposited.
 
Silver finishing, due to thickness, is particularly suitable for technologies where planarity is fundamental such as VFP-BGA- Press-Fit.
 
Differently form Chemical Tin, it has longer Shelf Life, 6 months more or less, and finishing Rework process is easier.
 
An important feature of this finishing is packaging through which the manufacturer packs the PCBs; is very important that the paper inserted between PCBs is Sulphur free to avoid contamination of Silver on the surface.
 
OSP                                                                                         Normative reference IPC-6012
 
OSP is an organic compound that selectively bonds with copper so to plate copper itself, providing an organic-metallic layer. Thickness, measured in A° (angstrom), protects it until soldering.
OSP is the surface finishing most used in the world, particularly in white industry due to low costs and easy-to-use.
Shelf life is limited, therefore is suggested to assemble PCBs within one month, but the chance to redo finishing on stored pieces makes it suitable for long storage necessities.
Standard OSP process doesn’t fit multiple soldering while OSP HT could support it.
 
HARD GOLD                                                                           Normative reference IPC-4552
 
Hard Gold finishing is composed by Nickel (3-6 µm) and Gold (0,8-1,2 µm), and it is realized through electrolytic galvanic process, that allows the finishing to plate copper.
 
Gold high thickness makes this selective finishing suitable for interference solutions (PCB with insertion connectors) but not suitable to soldering, even considering the high related costs.
 
ENEPIG                                                                                   Normative reference IPC-4556
 
ENEPIG finishing is composed by Nickel (3-7 µm), Palladium (0,05-0,25 µm) and Gold (0,02-0,05 µm), and it is realized through an immersion chemical process, that allows the finishing to plate copper.
ENEPIG was born as an updated version of ENIG, with the addition of a Palladium layer between Nickel and Gold.
Palladium layer plays the role of barrier to avoid Gold migration to Nickel layer, and of Nickel layer covering for the following Gold deposit reducing Nickel Spikes effect.
Moreover, ENEPIG offers high reliable Wire Bonding capacity.
 
HOT OIL REFLOW                                                                        Normative reference ECSS
 
Hot Oil Reflow is a finishing usually used for SPACE products; it is indeed the only ESA (European Space Agency) approved surface finishing.
It consists in re-melting, with high-temperature oil bath, the Tin-Lead electrolytically deposited on surface.
This finishing grants good coating planarity, usually 5-7 µm tin on surface, and limited thermal shock to base material.
Hot Oil Reflow technology, largely diffuse in ‘80s/’90s, isn’t use anymore except from who, such as Cistelaier, works in Space Sector.
 
 
In surface finishing’ choice, you need to evaluate its Shelf Life, meaning the operative window which grants the finishing to have a complete PCB weldability.
Finishing Shelf Life is strongly influenced by PCBs packaging and storage.
Is really important to pursue the right storage methodology (suggested by IPC-1601 guidelines) to preserve weldability and reliability, because of the high hygroscopic nature of the base materials with which PCBs are manufactured.
 
 
For more details, call us to +39 059 269711 or send and e-mail to sales@cistelaier.com.
Oct 25 2020
Press release

PCB, the heart of each electronic device

Date: October 25, 2020 11:00 PM

Each electronic device needs one or more PCBs, regardless of applications field and destination sector, from industrial to domestic sector, from automotive to medical sector, from avionics to railways, to renewal energy, to telecoms and many other sectors.
 
Each sector has specific regulation requirements and each application field presents different technical necessities.
 
For this reason it is crucial to know not only regulations and be qualified in each industrial sector, but also to be able to answer practically to technical requirements, typical of each different application.
 
What makes Cistelaier a “unique” PCBs manufacturer, is to be accredited for the following sectors:
 
-        Industrial: ISO 9001:2015
-        Aerospace & Defence: UNI EN 9100:2016
-        Automotive: IATF:2016
-        Medical: ISO 13485
-        Railway: ISO/TS 22163
 
and to handle the following standards
 
-        IPC-A-600, class 2, 3 or class 3DS(A)
-        IPC 6012 (Rigid), IPC 6013 (Rigid-Flex), IPC 6016 (HDI) and IPC 6018 (Microwave)
-        MIL-P-55110 (Rigid) and MIL-P-50884 (Rigid-Flex)
-        ESA-ECSS - Q – ST – 70 – 10C / 11C / 12C
-        ESA-ECSS - Q – ST – 70 – 60C
 
that are are the basis of design and manufacturing of each electronic device.
 
This is the necessary premise to be able to realize PCBs in each sector.
 
Then, practically, electronic devices performances could be improved starting from the base materials choice.
The more-than-40-years know-how of production, together with its capability to use different materials to satisfy the more different requirements, allows Cistelaier to supply optimized PCBs for each possible application.
 
We can support our partners to reach the best performances from their electronic devices in each sector, for each application.
 
Do not hesitate to contact us, our technicians are at your disposal!
 
Make a call to +39 059 269711 or send and e-mail to sales@cistelaier.com.

Location -  CISTELAIER S.P.A.

Opening hours -  CISTELAIER S.P.A.

Monday
Open
8:00 AM - 5:30 PM
Tuesday
Open
8:00 AM - 5:30 PM
Wednesday
Open
8:00 AM - 5:30 PM
Thursday
Open
8:00 AM - 5:30 PM
Friday
Open
8:00 AM - 5:30 PM
Saturday
Closed
Sunday
Closed

Key figures -  CISTELAIER S.P.A.

Turnover

Operating income

Net profit

Risk Assessment

Low
Medium
High

Activities -  CISTELAIER S.P.A.

Producer Distributor Service provider

Other classifications (for some countries)

ATECO (IT 2007) : Fabbricazione di altri componenti elettronici (261109)

NACE Rev.2 (EU 2008) : Manufacture of electronic components (2611)

ISIC 4 (WORLD) : Manufacture of electronic components and boards (2610)